Sony has reported the
development of a new
wireless intra-connection
technology that reduces the size and cost of components used in electronics such as TVs, allowing smaller and less-costly final products.

The millimeter-wave wireless technology identifies high speed wireless data transfer inside electronics and replaces complicated wires and internal circuitry with wireless connections, allowing a reduction in the size and cost of the IC and other components.

Getting technical

The advanced functionality of today's electronics requires large quantities of internal data transfer. Once wired connections approach the limit of their data capacity, additional circuitry is required to facilitate larger data transfers, but this leads to increasingly complicated IC packages, intricately printed circuit boards, and larger IC sizes.

By replacing physical circuitry in electronics products with high speed wireless connections, this new technology simplifies the IC package and printed circuit board. Due to the data transfer occuring without contact, the reliability of movable and detachable parts within the product is improved.

Sony will proceed with efforts to adopt this technology in a range of electronics products. It will be presented at "ISSCC 2010", to be held in San Francisco, California, US, 2010.

Key Features

·         Optimized circuit for intra-connection on CMOS-LSIs

·         Injection lock method realizes small size, low power consumption and sufficient transmission range for intra-connection